BYK-P 9065

BYK P 9065 is a processing additive with mold release properties that can be used for low-shrink SMC and BMC applications. BYK P 9065 completely replaces zinc stearate that is usually used as a mold release agent, simplifying raw material handling. Separation of the compounds is avoided and cobwebbing is reduced. Scrap rate is lowered due to reduced shrinkage and less warping, leading to higher gloss, lower haze, improved color homogeneity and overall better surface appearance of the finished parts. If the finished parts need to be painted or bonded, no sanding is required as BYK P 9065 is firmly anchored in the cured resin and does not migrate to the surface. Due to the low dosage of BYK P 9065, it is virtually cost neutral. BYK P 9065 provides benefits such as simplified formulation, reduced scrap rates, and better finished part quality that helps improve productivity and quality for various construction and industrial applications.