BYK-057 SG is a silicone-free defoamer on polymer-basis that is effective for solvent-borne and solvent-free formulations. BYK-057 SG prevents foam formation during manufacturing and application processes. It acts as an air-releasing agent and improves leveling. BYK-057 SG is recommended for use in industrial applications where it prevents foam and bubbles during processing without reducing intercoat adhesion. BYK-057 SG is particularly suitable for solvent-free UV curable formulations and overprint varnishes. It ensures optimal defoaming when added to the millbase and prevents crater formation.