BYK-LP D 24663

BYK-LP D 24663 is especially developed for defoaming of solvent borne high solids systems applied by Airless or Air-Assisted-Airless. BYK-LP D 24663 shows excellent defoaming even in high film thickness.To achieve full effectiveness the defoamer should be added in the let down stage of the formulation. If the system is sensitive to surface defects, add 2/3 of the defoamer amount during mill base and 1/3 in the let down stage.